2016 The Annual Conference on Engineering and Applied Science
Submission Online: http://aceat.org/guide.asp
Contact us: email@example.com
Organized by Higher Education Forum (HEF), the Annual Conference on Engineering and Applied Science (ACEAT 2016) is scheduled on November 22-24, in Kyoto, Japan.
The ACEAT Conference offers a great opportunity to bring together professors, researchers and scholars around the globe a great platform to deliver the latest innovative research result and the most recent development and trends in engineering and applied sciences field.
Original papers are invited on Biological Engineering, Chemical Engineering, Civil Engineering, Computer Engineering and Technology, Electrical and Electronic Engineering, Environmental Engineering, Information Engineering and Technology, Materials Science and Engineering, Mechanical Engineering and Technology, Aeronautics & Aerospace Engineering, Power & Energy Engineering, Applied Science...and many other topics in related area.The aim of the conference is to provide a platform to researchers and practitioners from both academia as well as industry to meet and share cutting-edge development in the field.
Dear scholars and friends,
On behalf of Higher Education Forum I would like to extend a very warm welcome to all of you to the Kyoto Joint Conference which will be held on 22-24 November, 2016 in Kyoto, Japan. The conference will bring together scientists from all over the world to exchange new ideas, recent results, and future perspectives in all aspects of science and engineering. The program will include keynote lectures by distinguished researchers as well as ample space for young researchers to present their works.
Kyoto is a very fitting venue to host “Kyoto Joint Conference”, being of course the spiritual and cultural capital of Japan. Kyoto is the heart of Japan and a city with over a millennium of history. More than one million tourists visit Kyoto each year. There are 17 UNESCO World Heritage sites in Kyoto, which was the former capital for 1000 years (794 to 1869) during which time many major temples, important shrines and imperial palaces were built there. Thus, attendees of this joint conference will be able to enjoy a very unique blend of tradition and culture in this city along with the hospitality of its citizens in a safe, comfortable environment, all of which make it a very appealing destination.
I sincerely hope you will enjoy your stay in Kyoto and bring home lots of experiences and knowledge from this conference.
Abstract Submission Deadline---------------
Aug. 5, 2016 Aug. 31, 2016
Acceptance Notification---------------------------Aug. 25, 2016
Early Bird Registration----------------------------Sep. 15, 2016
Registration Deadline-----------------------------Extended to Sep. 30, 2016
Final Paper Submission Deadline----------------Extended to Sep. 30, 2016
Conference Date----------------------------------Nov. 22-24, 2016
International Travel Package
In response to a large number of requests from Taiwan participants, the Travel Agency proposed conference travel package to Kyoto, Japan, only for conference. Detailed itinerary can be found below. If you have any questions, please contact the travel agent directly.
出發日期:2016年11月21日 歡喜服務專員:王怡文 0937-985464
Authors are required to use MS-Word templates obtained from the conference website as their paper format and submit .doc files of their manuscripts through the Online Submission System. Submission rules and download the paper template: http://aceat.org/index.asp?id=9.
All submissions will be under a paper-review conducted by experts in the field of electrical engineering and applied science based on originality, significance, quality and clarity.
Accepted and presented abstracts/ full papers at the conference will be published in the official conference proceedings and a selection of full papers will be recommended to the cooperative journals below. More journal details are available on the organizer, Higher Education Forum (HEF) website (www.prohef.org)
Note: Selected full papers will be recommended but are not guaranteed to be published in the journals.
For more details, please refer to: Publication Opportunity